LPC1765FBD100,551
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1 034
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Standort
US
Marke
NXP Semiconductors
Mpn
LPC1765FBD100,551
Beschreibung
ARM MCU, 32-bit, ARM Cortex-M3, 100 MHz, 256 Kilob
Technische Daten: LPC1765FBD100,551
China RoHS
Compliant
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
Yes
RoHS
Compliant
Height
1.45 mm
Height - Seated (Max)
1.6 mm
Length
14 mm
Terminal Pitch
500 µm
Width
14 mm
Case/Package
LFQFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
100
Number of Terminals
100
Country of Origin
Taiwan
Export Control Classification Number (ECCN) Code
3A991.A.2
Harmonized Tariff Schedule (HTS) Code
8542.31.00.25
Introduction Date
2009-11-24
Lifecycle Status
Production (Last Updated: 3 months ago)
Core Architecture
ARM
Data Bus Width
32 b
Frequency
100 MHz
Interface
CAN, I2C, I2S, IrDA, SPI, SSP, UART, USART, USB
Max Frequency
25 MHz
Max Operating Temperature
85 °C
Max Power Dissipation
1.5 W
Max Supply Voltage
3.6 V
Memory Size
256 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
2.4 V
Nominal Supply Voltage (DC)
3.3 V
Number of ADC Channels
8
Number of I2C Channels
2
Number of I/Os
70
Number of Programmable I/O
70
Number of PWM Channels
7
Number of SPI Channels
3
Number of Timers/Counters
4
Number of UART Channels
4
Operating Supply Voltage
3.3 V
Oscillator Type
Internal
Peripherals
Brown-out Detect/Reset, DMA, I2C, POR, PWM, WDT
RAM Size
64 kB
Temperature Grade
Industrial
Watchdog Timer
Yes
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