54150-0878
Verfügbare Menge
2 454
Versand möglich
fertig zum Versand
Standort
AT
Marke
Molex
Mpn
54150-0878
Datenblatt
Beschreibung
Conn Board to Board RCP 80 POS 0.5mm Solder ST SMD SlimStack™ T/R
Technische Daten: 54150-0878
Radiation Hardening
No
REACH SVHC
Yes
RoHS
Compliant
China RoHS
Compliant
Lead Free
Lead Free
Pitch
500 µm
Terminal Pitch
500 µm
Lead Pitch
500 µm
Row Spacing
4.5974 mm
Stack Height
2.5 mm
Plating
Gold
Housing Material
Thermoplastic
Number of Pins
80
Contact Material
Bronze
Contact Plating
Gold
Mount
Surface Mount
Lifecycle Status
Obsolete (Last Updated: 5 years ago)
Manufacturer Lifecycle Status
OBSOLETE (Last Updated: 5 years ago)
Country of Origin
JP
Min Operating Temperature
-40 °C
Number of Contacts
80
Voltage Rating (DC)
50 V
Number of Positions
80
Orientation
Vertical
Plating Thickness
254 nm
Gender
Receptacle
Insulation Resistance
100 MΩ
Max Operating Temperature
85 °C
Number of Circuits
80
Voltage Rating
50 V
Contact Gender
Female
Current Rating
500 mA
Number of Rows
2
Termination
SMD/SMT
Contact Resistance
40 mΩ
Max Voltage Rating (AC)
50 V
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